Безвентиляторный корпус LEX MIRO-3 (3 Layers) DIN-Rail Mounted Embedded Series

Спецификация безвентиляторного корпуса LEX MIRO-3 (3 Layers) DIN-Rail Mounted Embedded Series:

С корпусом MIRO-3 (3 Layers) DIN-Rail Mounted Embedded Series можно собрать систему:

CPU Type	M/B Model	VGA	DVI / HDMI	COM	LAN	USB	Audio	Operation Temp
								Industry mSATA	Industry SSD
Intel® Skylake / Kaby Lake i3 / i5 / i7 Celeron CPU	3I610CW	1	DVI	6	2	4	—	60ºC	—



Intel® Bat-Trail E3825 / E3845 / J1900	3I385AW / CW	1	DVI	6	2	4	—	70ºC	70°C



	3I380A / CW	1	HDMI	6	2	4	Line out / Mic-in	70ºC	70°C



Intel® Ivy Bridge 1047 UE 1.4GHz, i3, i7	3I847CW	1	DVI & HDMI	5	2	4	Line out / Mic-in	70ºC	70°C



	3I847NX	1	HDMI	2	1 + 4 x PoE	3	Line out / Mic-in	70ºC	70°C



Intel Cedarview-M N2600/2800	3I268A / CW	1	—	6	2	4	Option	70ºC	70°C